1. Responsible to lead the assembly engineering team to drive processes improvement to manufacture high quality world class electronics product. 2. Ensure the required technical support for all critical process is available for production. 3. Drive for quality, productivity, cost continuous improvements in all related manufacturing processes and efficiency. 4. Lead process automation and innovation activities. 5. Communicate with customers (especially overseas in Europe/U.S.) effectively on technical issues, DFX, new product launches, and product quality improvement. 6. Provide coaching and technical assistant to assembly engineering team to resolve internal and external technical unforeseen issue.

• Minimum Bachelor's Degree in Engineering or Material Science from an accredited university or equivalent experience.• Min 15 years experience in semiconductor assembly area. Process Engineering experience in both FOL and EOL assembly preferred. And at least 6 years at a managerial role. • Sound knowledge in DOE, APQP, PPAP, FMEA and Statistical Process Control. • Good oral and written communication skills, both Chinese and English.• Preferable and added advantage with experience in Leadframe design, Package design and Test.• Good team player.