To drive Lead Frame / Packing Material development activities to ensure the package fulfil all requirement in the aspect of manufacturing, product qualification and reliabilityYour roleKey responsibilities in your new roleTo drive Lead Frame / Packing Material development activities to ensure the package fulfil all requirement in the aspect of manufacturing, product qualification and reliabilityTechnical expert for lead frame / packing material (mold compound, epoxy, solder paste, wires) in package development projects Perform design, drawing and specification for lead frame/packing material based on design guideline, assembly rules and ensure design for manufacturing, quality and cost Collaborate with internal and material supplier on packing material design, specification and selection; and ensure design for manufacturing, quality and costDrive lead frame / packing material development activities and ensure fulfilment of project milestone deliverables, cost and documentation release (spec, drawing, GIMM, etc)Liaise with SQM and supplier to ensure fulfilment of quality requirement / FAI for lead frame/ packing material; and qualification releaseEstablish design guideline / requirement for lead frame / packing material specification Actively engages with lead frame / packing material suppliers to explore new technology, best in cost design, etc to achieve competitive advantages Generate technical papers / journals and patents related to lead frame / package design that enhances technical value#WeAreIn for driving decarbonization and digitalization.As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.Are you in?We are on a journey to create the best Infineon for everyone.We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.Please let your recruiter know if you need any accommodations during the interview process.

Your profileQualifications And Skills To Help You SucceedBachelor or Master’s Degree in Material Science, Chenical, Metallurgical Engineering or a related disciplineAt least 5 years of working experience in semiconductor packaging. Prior experience in SON, DSC, TO, DSO power product development is strongly preferredA structured and analytical mindset with a proven ability to drive complex topics independently from analysis to implementationGood aptitude for communication, collaboration, negotiation and solution findingKnowledge in material physics / properties for Lead Frame / substrates (DCB/AMB) and packing material (mold compound, epoxy glue, solder paste, WB wires, copper clip)Basic knowledge about semiconductor packaging, assembly and testStatistical data analysis, analytical and problem solving skills, e.g. 8D, DMAICCompetent in daily oral & written English for cross-functional and overseas communicationProject management experience is a benefit