简介

工作经历

• Project Manager

  DIXON (PADGET ELECTRONICS)

  2024.07-至今

  (1 年)

  June’2024 – Till Now SKILLS (MOBILE / TABLETS / LAPTOP MANUFACTURING) PROJECT OPERATIONS PM KAM (Key Account PROGRAM MANAGEMENTMANAGEMENT Manager) TPM PROCESS ENGG LEAD SMT MACHINES TRC- DEBUG AND ANALYSIS FATP/BOX ASSEMBLY NPI PROJECT DEFECT ANALYSIS Mounters(FUJI/PANASONIC) PROCESS PRINTERS/SPI/AOI STENCILS AND FIXTURE DESIGNING ICT/FCT/MMI TESTERS MATERIAL ANALYSIS REFLOW ADJUSTMENT/PROFILE CAM 350/ODB++/Gerber/ AutoCAD BOM/SAP MATERIAL LOSS IMPROVEMENTS SOLDERING DEFECT FAILURE ANALYSIS CUSTOMER SUPPORT KAIZENS/POKE YOKE END TO END PROJECT MANAGEMENT 8D REPORT /CUSTOMERS MEETING AND PRESENTATION TEAM MANAGEMENT AND LEAD PFMEA/CONTROL PLAN/ QUALITY DOCUMENTS REWORK PLAN – CUSTOMER COMPLAINTS HANDLING
• Asst. Manager

  VIVO

  2022.04-2024.06

  (2 年)

  Apr’2022- May’2024 SKILLS (MOBILE / TABLETS / LAPTOP MANUFACTURING) PROJECT OPERATIONS PM KAM (Key Account PROGRAM MANAGEMENTMANAGEMENT Manager) TPM PROCESS ENGG LEAD SMT MACHINES TRC- DEBUG AND ANALYSIS FATP/BOX ASSEMBLY NPI PROJECT DEFECT ANALYSIS Mounters(FUJI/PANASONIC) PROCESS PRINTERS/SPI/AOI STENCILS AND FIXTURE DESIGNING ICT/FCT/MMI TESTERS MATERIAL ANALYSIS REFLOW ADJUSTMENT/PROFILE CAM 350/ODB++/Gerber/ AutoCAD BOM/SAP MATERIAL LOSS IMPROVEMENTS SOLDERING DEFECT FAILURE ANALYSIS CUSTOMER SUPPORT KAIZENS/POKE YOKE END TO END PROJECT MANAGEMENT 8D REPORT /CUSTOMERS MEETING AND PRESENTATION TEAM MANAGEMENT AND LEAD PFMEA/CONTROL PLAN/ QUALITY DOCUMENTS REWORK PLAN – CUSTOMER COMPLAINTS HANDLING
• Process/Analysis Asst. Manager

  VIVO MOBILE INDIA PVT LTD

  2022.04-2024.06

  (2 年)

  from (APR,2022 –May’2024) · Lead the SMT, Assembly and Warranty/Aftersales Section for Failure Device/PCBA’s. · To Propose the timely RCA and CAPA for the Defect Cause and generation. · To Achieve the KPI/KRA Goals Along with the Improvement Projects. · Initiate and Lead the Cost Optimizing/Process Development/Skill Development Projects
• Senior Engineer

  DIXON (PADGET ELECTRONICS)

  2021.03-2022.03

  (1 年)

  Mar’2021- Mar’2022 SKILLS (MOBILE / TABLETS / LAPTOP MANUFACTURING) PROJECT OPERATIONS PM KAM (Key Account PROGRAM MANAGEMENTMANAGEMENT Manager) TPM PROCESS ENGG LEAD SMT MACHINES TRC- DEBUG AND ANALYSIS FATP/BOX ASSEMBLY NPI PROJECT DEFECT ANALYSIS Mounters(FUJI/PANASONIC) PROCESS PRINTERS/SPI/AOI STENCILS AND FIXTURE DESIGNING ICT/FCT/MMI TESTERS MATERIAL ANALYSIS REFLOW ADJUSTMENT/PROFILE CAM 350/ODB++/Gerber/ AutoCAD BOM/SAP MATERIAL LOSS IMPROVEMENTS SOLDERING DEFECT FAILURE ANALYSIS CUSTOMER SUPPORT KAIZENS/POKE YOKE END TO END PROJECT MANAGEMENT 8D REPORT /CUSTOMERS MEETING AND PRESENTATION TEAM MANAGEMENT AND LEAD PFMEA/CONTROL PLAN/ QUALITY DOCUMENTS REWORK PLAN – CUSTOMER COMPLAINTS HANDLING
• NPI SR. ENGG

  DIXON -PADGET ELECTRONICS

  2021.03-2022.03

  (1 年)

  · Worked on Motorola Mobile Phone for Domestic and North America Project. · Major task is to Meet the DVT, PVT, PILOT Run Dates and Quality Targets. · To manage the Project from END to END with CFT and Other Teams to drive the Project On-time. · To Handle Daily/weekly Projects Meetings with Customer. · To Take Care of SMT Process Improvement Activities, Jigs Fixture and Stencils Improvements.
• Engineer-3

  OPPO INDIA PVT LTD

  2019.06-2021.03

  (2 年)

  June’2019- Mar’2021 SKILLS (MOBILE / TABLETS / LAPTOP MANUFACTURING) PROJECT OPERATIONS PM KAM (Key Account PROGRAM MANAGEMENTMANAGEMENT Manager) TPM PROCESS ENGG LEAD SMT MACHINES TRC- DEBUG AND ANALYSIS FATP/BOX ASSEMBLY NPI PROJECT DEFECT ANALYSIS Mounters(FUJI/PANASONIC) PROCESS PRINTERS/SPI/AOI STENCILS AND FIXTURE DESIGNING ICT/FCT/MMI TESTERS MATERIAL ANALYSIS REFLOW ADJUSTMENT/PROFILE CAM 350/ODB++/Gerber/ AutoCAD BOM/SAP MATERIAL LOSS IMPROVEMENTS SOLDERING DEFECT FAILURE ANALYSIS CUSTOMER SUPPORT KAIZENS/POKE YOKE END TO END PROJECT MANAGEMENT 8D REPORT /CUSTOMERS MEETING AND PRESENTATION TEAM MANAGEMENT AND LEAD PFMEA/CONTROL PLAN/ QUALITY DOCUMENTS REWORK PLAN – CUSTOMER COMPLAINTS HANDLING
• SMT L3 ENGINEER/NPI PROJECT LEADER

  OPPO INDIA PVT LTD

  2019.06-2021.03

  (2 年)

  Worked as a SMT engineer and major is Mounting department that include MPM printing machine, PARMI and Koyoung SPI machine , FUJI (NXT III), BTU REFLOW, Process and quality improvements. Downloading and testing fail PCB analysis of material or soldering defect. Rework and repair process. Worked as a SMT NPI project leader for oppo, 1+ and realme. Technical · Stencil and jigs and fixtures improvement (using CAM 350) · Solder paste improvement on pcb pad according to the component package size. · Momentum Printing machine programming skills and hardware changes. · Solder paste thrust and soldering defect analysis. · NXT III module program editing / preventive maintenance · PARMI and Koyoung SPI programming skills/hardware analysis. · Basics of BTU reflow temperature standard and adjustment in N2. · Incoming material issues with vendor dealing and cost summary stage. · MES and ERP basic functioning. · To set the Reflow parameters according to the fixture types and the component package size. · To Set the Under-fill Glue, Thermal Gel and Epoxy Process for PCBA. · SOP Preparation for Complete SMT Process. · To Make Control Plan, PFMEA and PFC. · Implementation of Kaizen Activities and Poke Yoke.

项目

• LENOVO/OPPO/VIVO/MOTOROLA/XIAOMI/GOOGLE

  PROJECT MANAGER

  2021.03-至今

  (5 年)

  To complete Look after the Project from End to End. From Kick off to Project Life Cycle complete : From BOM enablement to Palletization and Market shipment.

教育经历

• Amity University

  MBA (Operations and Production)

  2022.05-2024.07

  (2 年)

  I have completed my Masters Degree in Production and Operations in Manufacturing. To Upgrade my skills in Project management
• ABES Engineering College

  B.Tech(Electronics and Communication)

  2015.06-2019.03

  (4 年)

  I have done my Engineering Degree in Electronics and Communication and have core knowledge of PCBA and circuit designing.

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