工作经历

• Engineering Technician

  Nepes Hayyim Corp.

  2017.07-2025.06

  (8 年)

  at NEPES HAYYIM with
• Production Operator / Inspector

  Philinak Industries Inc.

  2015.10-2016.04

  (7 个月)

  interconnect solutions provider that initially offers Wafer Level Chip Scale Packaging (WLCSP) services to the semi-conductor industry. Knowledgeable in Silicon Wafer BACKGRIND, BACKSIDE and AUTOMATED OPTICAL INSPECTION machine and process. Perform Standard Operating Procedure (SOP) Knows all defect Criteria and 100% inspection according to specification Ensure good quality output based on defined parameters and control and on-time delivery of products. Familiarize in Laser Marking and Wafer Saw process. Perform minor set-up and machine adjustment. Observe and report machine abnormalities whether machine, process and material related issues. Escalate problem(s) encounter to the supervisor. Understand and follow safety requirements of the machine and process in the designated area. Knows how to properly execute correct disposition. Ability to prioritize and handle multiple tasks simultaneously. Ability to work under time pressure, long hours and strict deadlines Hardworking, flexible, able to work in different shift schedule and work as a team. 100% inspection of Assy Product Packaging of Inspected Assy

教育经历

• Kolehiyo ng Lungsod ng Lipa

  Computer Science

  2010.07-2015.04

  (5 年)

  Graduate

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