Sandeep's 简历

Sandeep

Equipment & Process Technician

住在印度

国籍印度

简介

I started my Career July 2022 in a semiconductor Manufacturing plant as a process and equipment technician. Between in those years I learnt lots of skills and collected important knowledge of machines. I worked peacefully and very honesty and always tried to give my best from my side. always doing worked along with team and getting achievement in our all process. I always loved to work with team and want to growing our skills and Knowledge. Familiarity with safety precautions ensures all work is up to standards. Strengths include problem solving skills, capability to understand technical manuals and adaptability in diverse working environments. Contribution in previous roles includes streamlining processes for improved efficiency and reduced downtime.

工作经历

Equipment & process Technician
Sahasra Semiconductors Private Limited
2025.07-至今
(1 年)
#Machine Knowledge: 1. WIRE BOND (K&S Powernexx & Rapit ELA)- I have knowledge about of Parameters Troubleshooting, Hardware to software and machine installation, Machine Conversion One Setup to Another Setup, Calibration relative and preventive maintenance of machine. 2. DIE ATTACH (KSEM AD200) - I have knowledge about of Parameters Troubleshooting, Hardware to software and machine installation, Machine Conversion One Setup to Another Setup, Calibration relative and preventive maintenance of machine. 3. DIE ATTACH (FASFORD DB830plus+D)- I have knowledge about of Parameters Troubleshooting, Hardware to software and machine installation, Machine Conversion One Setup to Another Setup, Calibration relative and preventive maintenance of machine. 4. DICING AND SAW (DISCO 6363) – I worked in this machine and have knowledge about how to create a new recipe for others packages and all equipment tools changes during setup process. parameters troubleshooting, how to do change blades, how to do solve problem from software relative. Machine installation and about machine maintenance. 5. BG TAPE LAMENATOR (GENESEM) - It is using for fixed tape on back side of the wafer surface. I have knowledge about how to create a new recipes and changes new blades. how to fixed the new tape in during of setup, parameters troubleshooting, Hardware to Software. Machine installation, and about machine maintenance. 6. PLASMA CLEANER (NORDSON)- It is using for removing dust particles from die surface and lead frames. I have knowledge about creating new recipes and set the parameters according to packages. parameters troubleshooting. machine installation and about machine maintenance. NOTE: Process manufacturing for making a micro SD card, QFN and BGA, SOIC packages qualification for new products, Root cause and defect analysis, documentation, Making SOP for different process. machines purgation customer complaints. OEE, yield Analysis and actions plans TPM Coordinator, good knowledge troubleshooting of machines parameters. • Responsible for root cause analysis of failure. • Execute projects related to productivity & quality improvement, Kaizen. • To increase the MTBF and decrease the MTTR. • To prepare & provide all maintenance related reports calculation of MTTR, MTBF and breakdown of machine. • Maintain the machine tool at the line according to the requirements.
PROCESS AND EQUIPMENT TECHNICIAN
IDEMIA semiconductor
2022.07-2025.01
(3 年)
@ Machine Knowledge: 1. Wire bond 2. Die attach 3. Chip encapsulation machine 4. Chip module test. 1. WIRE BOND (ASM EAGLE AERO)- I have lots of knowledge about this machines that how to solve problems from software relatives and hardware relatives. new recipes creation and machine conversion one package to another package. how to do set a good parameter for buyoff. parameters troubleshooting. calibration relatives and about machine maintenance. 2. DIE ATTACH (ASM AD8312 PLUS SD)- I have lots of knowledge about this machines that how to solve problems from software relatives and hardware relatives. new recipes creation and machine conversion one package to another package. how to do set a good parameter for buyoff. parameters troubleshooting. calibration relatives and about machine maintenance. Know about various type of power supply used in Wire Bond and Die Bond machines. Hard on experience of model Changeover of Wire Bond and Die bond machines. CME machine (Chip Module Encapsulation) Setup Troubleshooting & Calibration. CMT machine (Chip Module Testing) Setup Troubleshooting & Calibration. Implemented maintenance schedules to minimize downtime and maximize efficiency. Collaborated with CFT to address equipment related issue. Maintained accurate records of maintenance activities and equipment performance. Know about various mode of PR using in ASM machines. NOTE: - I have expertise in wire bond and die bond process manufacturing, qualification, documentation, documentation for smart card. Machine installation and up-gradation customer complaints, troubleshooting the parameters of machines, OEE, Yield Analysis and OCAP, TPM Coordinator, root cause analysis.