Project Management - OSATJob DescriptionIn your new role you will: Responsible for package development tasks in OSAT: package definition, technology integration and project management. Responsible for new process development and new product introduction in OSAT. Perform technical ramp up management for seamless transition during new product / package ramp up phases into serial production. Responsible for enabling of new package platform and derivatives packages, and support of technology and package development at OSAT. This includes new subcon enabling support role. Responsible for OSAT change management projects (major changes) ensuring projects are executed fulfilling project requirements. Identify package level opportunities for cost down and executes cost down projects Responsible for package platform assessment between subcons and provides mapping to in-house capability supported by the segments and package platform managers. Co-ordination/support alignment of Subcon Technology roadmaps with Segments and PTI. Manages subcon technical days with subcon partners#WeAreIn for driving decarbonization and digitalization.As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.Are you in?We are on a journey to create the best Infineon for everyone.This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting.Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.Click here for more information about Diversity & Inclusion at Infineon.

Your ProfileYou are best equipped for this task if you have: Masters/Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical), Physics, Chemistry Min. 8 years hands-on experience in managing subcons (assembly/ process engineering) with 5 years in project management Good experience of FAR, 8D, audit skills, project systematics Working in a cross functional team comprising different cultural background Good communication and presentation skills Able to travel on short notice to support critical topics in assembly engineering